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Offered by Technical Association of the Pulp and Paper Industry
Are you a TAPPI Student Chapter member enrolled in a packaging or related major? If so, you’re in luck!
The International Flexible Packaging and Extrusions – The Daniel Siegel Memorial Scholarship is an amazing $7,000 scholarship opportunity offered to TAPPI (Technical Association of the Pulp and Paper Industry) Student Chapter members who are currently enrolled in an undergraduate packaging or related major. Industries related to these technologies include: packaging, industrial films and laminations, blown and cast film extrusion, extrusion coatings and laminations, sheet extrusion, and printing associated with these areas. Applicants must also demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusions Division. However, bear in mind that this scholarship is only open in even-numbered years.
If this sounds like a good opportunity for you, we encourage you to apply when it opens! Keep on reading to learn more.
Learn more and apply through the scholarship program’s website here
The Technical Association of the Pulp and Paper Industry is a not-for-profit, volunteer-led association that is built around a community comprised of thousands of member engineers, managers, scientists, academics, suppliers and others from around the world. They provide premier educational resources to support the day-to-day duties of industry professionals, as well as research and academic pursuits. They provide up to $140,000 each year in awards and scholarships.
In addition to meeting the below eligibility criteria, applicants must be enrolled in a packaging or related major.
College Students
Paper and Pulp Engineering
Paper and Pulp Engineering
Applicants must be TAPPI Student Chapter members.
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See all opportunitiesBased on previous application cycles, we expect this scholarship to reopen in January 2027. Save for later and we’ll notify you over email before the next deadline hits.
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