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International Flexible Packaging and Extrusions – The Daniel Siegel Memorial Scholarship
This scholarship might not currently be accepting applications. Most scholarship programs only accept applications a few months ahead of their annual deadline. We’ve estimated this deadline based on last year’s deadline in order to help you plan out your scholarship applications.
February 25, 2024International Flexible Packaging and Extrusions – The Daniel Siegel Memorial Scholarship
Offered by Technical Association of the Pulp and Paper Industry
The International Flexible Packaging and Extrusions – The Daniel Siegel Memorial Scholarship will be awarded to a TAPPI Student Chapter member enrolled in a packaging or related major. Industries pertaining to these technologies include packaging, industrial films and laminations, blown and cast films extrusion, extrusion coatings and laminations, sheet extrusion, and printing associated with these areas. Applicants must demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusions Division.
About Technical Association of the Pulp and Paper Industry
The Technical Association of the Pulp and Paper Industry is a not-for-profit, volunteer-led association that is built around a community comprised of thousands of member engineers, managers, scientists, academics, suppliers and others from around the world. They provide premier educational resources to support the day-to-day duties of industry professionals, as well as research and academic pursuits. They provide up to $140,000 each year in awards and scholarships.
Open to the following grade levels:
Eligibility information
This scholarship is open to students meeting the below eligibility criteria.
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Application information
To apply for this scholarship, submit the below application materials before the deadline.
