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Offered by Technical Association of the Pulp and Paper Industry
The International Flexible Packaging and Extrusions – The Daniel Siegel Memorial Scholarship will be awarded to a TAPPI Student Chapter member enrolled in a packaging or related major. Industries pertaining to these technologies include packaging, industrial films and laminations, blown and cast films extrusion, extrusion coatings and laminations, sheet extrusion, and printing associated with these areas. Applicants must demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusions Division.
The Technical Association of the Pulp and Paper Industry is a not-for-profit, volunteer-led association that is built around a community comprised of thousands of member engineers, managers, scientists, academics, suppliers and others from around the world. They provide premier educational resources to support the day-to-day duties of industry professionals, as well as research and academic pursuits. They provide up to $140,000 each year in awards and scholarships.
This scholarship is open to students meeting the below eligibility criteria.
College Students
Paper and Pulp Engineering
To apply for this scholarship, submit the below application materials before the deadline.
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